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Green FR4 TG175 Hard Gold PCB Automatic Control Circuit Design

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Shenzhen Xinchenger Electronic Co.,Ltd

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Green FR4 TG175 Hard Gold PCB Automatic Control Circuit Design

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : FR4

Layer : 8

Color : Green

Min line space : 4mil

Min line width : 4mil

Copper thickness : 1OZ

Board size : 200*72MM

Panel : 1

Surface : Immersion Gold

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FR4 TG175 Hard Gold PCB Automatic Control Circuit Design

Description:

We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided to multilayer PCB to you.
F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4 is a glass fiber epoxy laminate.FR4 is the Main material for PCB manufacture, it is the excellent quality and reasonable price material
FR-4 is widely used for single and multilayer boards, which has excellent thermal tolerance as much as 130°C. Now this type material FR-4 is more widely manufactured, but the hence is less costly.

Features:
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability

specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )

Parameter:

Product name	FR4 PCB	Double side	4 layer	6 layer	8 layer	10-28layer
layer	Single side	Double side	4 layer	6 layer	8 layer	10-28layer
Base Maerial	FR4	FR4,Alu,polymide	FR4	FR4	FR4	FR4
Copper thickness	1-6OZ
Min.Hole size	0.1mm
Min.Line Width	0.1mm
Surface finishing:	HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker color	green,red,black,white,yellow
Silkscreen color	black,white,yellow
Tolerance	- Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirements	Buried and blind vias+controlled impedance +BGA

Rigid PCB Manufacturing Capabilities

Total Pad Size	Standard	Advanced
Capture Pad	Drill + 0.008	Drill + 0.006
Landing Pad	Drill + 0.008	Drill + 0.006
BC Mechanical Drill (Type III)	0.008	0.006
Laser Drill Size	0.004-0.010	0.0025
Material Thickness	0.0035	0.0025
Stacked Via	Yes	Yes
Type I Capabilities single & Double Deep	Yes	Yes
Type II Capabilities Buried Vias with Microvias	Yes	Yes
Type III Capabilities	Yes	Yes
Copper Filled Microvia	Yes	Yes
Smallest Copper Filled Microvia	0.004	0.0025
Copper Filled Microvia Aspect Ratio	0.75:1	1:01
Smallest Laser Microvia Hole Size	0.004	0.0025
Laser Via Aspect Ratio (Depth:Diameter)	0.75:1	1:01

Layers	1-16 layers	Min Board Thickness(2-layer)	0.2mm
Max Board Size	635 × 1100mm	Min Board Thickness(4-layer)	0.6mm
Min Board Size	20 × 30mm	Min Inner-layer Thickness	0.1mm
Min Trace	0.1mm	Min Annular Ring	0.1mm
Min Space	0.1mm	Min Hole Location Tolerance	±0.075mm
Min Hole Size	0.2mm	Min Hole Size Tolerance	±0.05mm
Board Warp	≤ 1°	Min Outer Dimension Tolerance	±0.1mm
Solder Mask	Green, Yellow, Red, Black, Blue, White
Surface Finish	HAL, HASL, Immersion Gold, Immersion Silver, Plating Gold, Plating Nickel, Plating Silver, Gold Finger, OSP
Board Material	FR-4, High Tg FR-4, Thick Copper FR-4, Rogers, Taconic
Acceptable file	Gerber file(RS-274-X or RS-274-D with aperture list and drill files),Protel,PADS,POWERPCB,AutoCAD,ORCAD
CAM software	Genesis, CAM350

Product Tags:

pcb manufacturing process

fr4 circuit board

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