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Brand Name : XCE
Model Number : XCEM
Certification : CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Material : Rogers
Layer : 4
Color : Green
Min line space : 5mil
Min line width : 5mil
Copper thickness : 2OZ
Board size : 201*110mm
Panel : 1
Surface : ENIG
Other : Impedance Control
Customized Rogers 4350 High TG170 pcb printed circuit board RF Application 1oz Copper
Quick detail:
| Origin:China | Special: High frequency pcb | 
| Layer:4 | Thickness:0.508mm | 
| Surface: ENIG | Hole:0.2 | 
Basic Info
Model NO.: XCEPCB002
Dielectric: Rogers
Application: RF Remote Control Transmitter
Mechanical Rigid: Rigid
Base Material: Copper
Brand: XCE
Thickness: 0.508mm
Surface: Enig
Trademark: XCE
Specification: UL(US&Canada). ISO. RoHs, TS, SGS
HS Code: 8534009000
Type: Rigid Circuit Board
Flame Retardant Properties: V0
Layer: 4
Trace: 0.125mm
Soldmask: Green
Transport Package: Vacuum Package
Origin: Shenzhen, China
Typical Applications:
Features:
Rogers pcb multilayer pcb with high frequency can improvide the products quality ,
with high techolonogy treatment improve the life cycle of the products .
The high frequency rogers pcb with 4 mil 1 oz ,also with DHI half hole blind buried techonology .
Immersion gold surface finish make the pcb 's conductive performance enhancements.
Multilayer pcb design ,the precision of the pcb improves much more better .
Low dielectric : 3 dielectric conductivity much more precision .Rogers material used in RF Microwave fields in radar system .
Specifiction:
layer:4
board thickness:0.508mm
Copper thickness:1oz
min Hole size:0.2mm
min line width and distance:10/10mil
Surface treatment: imersion gold
Application: RF Remote Control Transmitter
Parameter:
| o | Item | Data | 
| 1 | Layer: | 1 to 24 layers | 
| 2 | Material type: | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers | 
| 3 | Board thickness: | 0.20mm to 3.4mm | 
| 4 | Copper thickness: | 0.5 OZ to 4 OZ | 
| 5 | Copper thickness in hole: | >25.0 um (>1mil) | 
| 6 | Max. Board Size: | (580mm×1200mm) | 
| 7 | Min. Drilled Hole Size: | 4mil(0.1mm) | 
| 8 | Min. Line Width: | 3mil (0.075mm) | 
| 9 | Min. Line Spacing: | 3mil (0.075mm) | 
| 10 | Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | 
| 11 | Solder Mask Color: | Green/Yellow/Black/White/Red/Blue | 
| 12 | Shape tolerance: | ±0.13 | 
| 13 | Hole tolerance: | PTH: ±0.076 NPTH: ±0.05 | 
| 14 | Package: | Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing | 
| 15 | Certificate: | UL,SGS,ISO 9001:2008 | 
| 16 | Special requirements: | Buried and blind vias+controlled impedance +BGA | 
| 17 | Profiling: | Punching, Routing, V-CUT, Beveling | 
Karen-Sales Department
ShenZhen Xinchenger Electronics Co.,Ltd
sales3@xcepcb.com
Skype:karen-xcepcb
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